| 摘要 |
<p>PROBLEM TO BE SOLVED: To surely prevent the peeling of a molding resin from a substrate by providing notched sections on the peripheral edge section of a substrate so as to make the molding resin flow in the notched section when the resin molded. SOLUTION: A BGA semiconductor device A has a package constituted by molding an IC chip 2 and bonding wires 3 with a thermosetting resin 5 on the upper surface of a nearly square film substrate 1. Since the resin 5 which flows and cures in notched sections 6 at the time of molding the resin 5 holds the substrate 1 in a wrapping state, the adhesion between the substrate 1 and resin 5 is improved and the peeling of the resin 5 from the substrate 1 can be prevented efficiently. Therefore, the peeling of the resin 5 from the substrate 1 from which the resin 5 easily peels can be prevented efficiently even when the number of notched sections 6 is small, because the resin 5 holds the substrate 1 by wrapping the corner sections of the substrate 1.</p> |
