| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment device and a heat treatment method capable of effectively preventing warping of a substrate in the heat treatment of the substrate. SOLUTION: The heat treatment device for heat-treating a substrate G has a heating plate 42 for heating the substrate G and a heat storage member 51 which is arranged in the position corresponding to the central part of the substrate, G between the heating plate 42 and the substrate G, and is arranged in the central part of the substrate G when it is heated with the heating plate 42, for storing a part of heat from the heating plate 42, and the central part and the peripheral part of the substrate G are heated to the uniform temperature.
|
