发明名称 |
METHOD AND DEVICE FOR PLASMA TREATMENT |
摘要 |
PURPOSE: A method for performing a plasma treatment, such as etching on a substrate by using a high-frequency induced plasma is disclosed. CONSTITUTION: The plasma treatment is performed on a substrate (7) placed on an electrode (6) by generating plasma in a vacuum chamber (1) by supplying a high-frequency power respectively to a spiral antenna (5) from a high frequency power source (4) for antenna and to the electrode (6) from a high-frequency power source (8) for electrode while the inside of the chamber (1) is maintained at a prescribed pressure by evacuating the chamber (1) while a prescribed gas is introduced into the chamber (1), wherein the inside of the chamber (1) is heated to 80°C or above by connecting a resistance heating heater (11) composed of a heating element shielded from an electromagnetic wave by a conductor outer layer and a pressure-bonded thermocouple (12), providing a heat insulator (13) between he heater (11) and the antenna (5), and also providing an inner chamber (16) equipped with a belt heater (22)
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申请公布号 |
KR20000010643(A) |
申请公布日期 |
2000.02.25 |
申请号 |
KR19987008592 |
申请日期 |
1998.10.26 |
申请人 |
MATSHSHITA ELECTRIC INDUSTRIAL CO., LTD |
发明人 |
OKUMURA, TOMOHIRO;NAKAYAMA, ICHIRO;WATANABE, SHOZO;HARAGUCHI, HIDEO |
分类号 |
H01J37/32;H01L21/3065;(IPC1-7):H01L21/306 |
主分类号 |
H01J37/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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