发明名称 COMPONENT MOUNTING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To mount components with accuracy, without making equipment complicated by fixing the components on a body to be mounted with components by heating a suction nozzle by a laser, instead of an illumination light, which serves for a heating means for heating a suction nozzle as well as providing illumination light and, at the same time, heating the suction nozzle also from the side of the body to be mounted with components. SOLUTION: A suction nozzle 2 is heated by a CO2 laser 6, instead of illumination light for an image-pickup means 4, which serves for a heating means for heating the suction nozzle 2 as well as providing illumination light. Here, not only by the CO2 laser 6, is the suction nozzle 2 heated but in cooperation with the substrate 8 side to fix a component 1 onto the substrate 8. In this case, the position of the component 1 with respect to the suction nozzle 2 is detected by the image-pickup means 4. Based on a corrected value for the position of the component 1, a control section 12 is operated to drive an XY stage 10 and a Z stage 11, and the component 1 is positioned at a correct plate on the substrate 8. Then, an adhesive attaching to the component 1 is melted by heating from the substrate 8 side and transmission of heat from the suction nozzle 2. Thereby, a component can be mounted with high accuracy and efficiency.
申请公布号 JP2000059098(A) 申请公布日期 2000.02.25
申请号 JP19980218947 申请日期 1998.08.03
申请人 NEC CORP 发明人 UMEMOTO KAZUNOBU
分类号 B25J15/06;H01L21/52;H01L21/60;H05K3/34;H05K13/04 主分类号 B25J15/06
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