| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of large processing strains in the island section of a lead frame by correcting the warping of the island section, by pressing the central part of the island section from the dimpled surface of the island section with a die after the island section is dimpled. SOLUTION: In order to form dimple in an island section, the island section is crushed with a dimple forming projection. The island section is corrected by providing a projecting section 7 which pushes up the central part of the island section in the warping direction of the island section and a relief recess in the opposite direction. After a semiconductor chip is firmly stuck to the island section of the lead frame and the electrodes of the chip are electrically connected to the front ends of inner leads through bonding wires, an inner lead section and the semiconductor chip are selected with a resin including the bonding wires. Therefore, the product yield of the lead frame can be improved remarkably by suppressing the warping of the island section. |
