| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed board, which continues to laminate respectively and alternately insulating resin layers and signal wiring conductor layers on both surfaces of a base material and includes a polishing process, which can polish the surface of the insulating resin layer on one side of the insulating resin layers and the surface on one side of both surfaces of the base material into a roughly parallel surface. SOLUTION: Signal wiring conductor layers 23a and 23e of a desired pattern are respectively formed on the surfaces of a base material 21. The parts of the edges of the surfaces of the material 21 are left, and insulating resin layers 24a and 24b, which respectively cover the layers 23a and 23b, are formed. The layer 24b is polished in a state in that a polishing stopper member 14 of a polishing rate lower than those of the layers 24a and 24b is brought into contact with the part of the edge 61 on one side of the edges of the surfaces of the material 21. Thereby, the layer 24b is polished down to the thickness of the member 14, with the surfaces of the material 21 as a reference.
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