| 摘要 |
PROBLEM TO BE SOLVED: To provide a warpage correcting mechanism for printed substrate in a reflow device, capable of positively preventing the warping, bending in a substrate being heated in a reflow furnace while directly holding the printed substrate by endless belt, without using automorphic guide plates when using endless belts as a carrying means of thin flexible printed substrates which are liable to be warped due to heating. SOLUTION: In a reflow device with two endless belts 22 carrying a flexible printed substrate 31 to a reflow furnace 23, the two endless belts arranged facing opposite each other at a specific intervals are constituted of multiple holding members 40 connection-arranged at a specific pitch in the circumferential direction. In such a constitution, a guide member 24 is arranged on the upper side of an upper side running region of the endless belts positioned in the reflow furnace, so that the guide member 24 depresses the upper side of a flexible printed substrate end edge mounted on a base piece 41 by depressing an opening and closing piece 43 in the closing direction against an elastic member 44.
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