摘要 |
PROBLEM TO BE SOLVED: To provide a strip board for packages, which raises yield in manufacturing electronic components and allows semiconductor elements to be surely and efficiently incorporated in a good package or the package to be assembled in various electronic products even at customer sites. SOLUTION: A plurality of packages 14 composed of single products subjected to product inspections are held cuttable/separable in a product holding frame 11, which is composed of frame plates having package hold spaces 12 inside and the packages 14 are coupled through cuttable/separable coupling tabs 13 to the inner walls of the frame plates. An auxiliary product holding frame is mounted on the inner walls o the frame plates through cuttable/separable coupling tabs, and the packages are mounted removably in the auxiliary product holding frame 34.
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