发明名称 STRIP BOARD FOR PACKAGES
摘要 PROBLEM TO BE SOLVED: To provide a strip board for packages, which raises yield in manufacturing electronic components and allows semiconductor elements to be surely and efficiently incorporated in a good package or the package to be assembled in various electronic products even at customer sites. SOLUTION: A plurality of packages 14 composed of single products subjected to product inspections are held cuttable/separable in a product holding frame 11, which is composed of frame plates having package hold spaces 12 inside and the packages 14 are coupled through cuttable/separable coupling tabs 13 to the inner walls of the frame plates. An auxiliary product holding frame is mounted on the inner walls o the frame plates through cuttable/separable coupling tabs, and the packages are mounted removably in the auxiliary product holding frame 34.
申请公布号 JP2000058688(A) 申请公布日期 2000.02.25
申请号 JP19980239554 申请日期 1998.08.10
申请人 SUMITOMO KINZOKU ELECTRO DEVICE:KK 发明人 TAKAI JUNICHI;OGUCHI TAKAYA
分类号 H01L23/00;H01L23/04;(IPC1-7):H01L23/04 主分类号 H01L23/00
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