| 摘要 |
PURPOSE: A polishing pad is provided to satisfactorily polish the surface of the semiconductor silicon wafer and the like. CONSTITUTION: The polishing pad includes; plural polishing elements(11) made up of the very thin tube or the hollow fiber having the cylindrical shape of the same diameter and the same length of the axial line direction and using the fluoric resin or the high molecular plastic such as polypropylene, polyethylene, polyacetyl, urethane plastic and the like, and its surface integrally combined to a flat board structure(10) consisting of the ending side of the axial line direction of the polishing element(11). |
