| 摘要 |
PROBLEM TO BE SOLVED: To correspond to the high density and compactness in size and width of a lead and improve the yield of products by forming a lead pattern in a manner to connect leads mutually in a lead tip part, and cutting the connecting part of the lead tip part to separate every lead individually before connecting them to a semiconductor device. SOLUTION: An adhesives 2 is applied to an insulation film having a device hole, and a copper foil 3 is adhered thereto and a resist layer is provided on its surface. Then a mask is brought closely into contact with the resist layer, and it is exposed and developed. Further, the exposed copper foil part is etched to form a wiring pattern, and the remaining resist layer is removed. The lead tip parts 4 of the wiring pattern are entirely connected mutually, and when connecting them to semiconductor elements, the connection parts of the lead tip part 4 are cut into individual leads. Therefore, no wiring for plating conduction is provided to the periphery part at every lead, so that the density of broken wire can be reduced and a wiring of smaller laying length can be designed. |
