| 摘要 |
PROBLEM TO BE SOLVED: To prevent adherence deterioration of a lead frame and a sealing region, by making outer terminals metal members fixed and connected with a lead of a lead frame. SOLUTION: In a semiconductor device 1, outer terminals 13 constituted of a metal column are fixed and connected with a pair of recessed shoulder parts 14 which are arranged on both sides of an intermediate pat of a lead 3 of a lead frame 2. A semiconductor element 5 is mounted on the lead frame 2, and an electrode of the semiconductor element 5 is electrically connected with the lead 3 through a metal thin wire 6. The semiconductor element 5, the metal thin wire 6 and the lead frame 2 containing the outer terminals 13 fixed and connected with the shoulder parts 14 of the lead 3 are sealed with resin. At this time, sealing is so performed that end portions of the outer terminals 13 fixed and connected with the shoulder pats 14 are exposed on the surface of the semiconductor device 1, and solder balls 9 or solder bumps are mounted on the outer terminals 13. As a result, resin can be sufficiently thickened on the outer terminal side, permeation of water content from the outside is prevented, and deterioration of adherent of the lead frame and sealing resin can be prevented. |
