REUSABLE DIE CARRIER FOR BURN-IN AND BURN-IN PROCESS

摘要

PURPOSE: A reusable carrier for burin-in and burn-in process is provided, which temporarily holds an integrated circuit as an unpackaged die or a chip-scale package during the integrated circuit is burned in or is tested. CONSTITUTION: The reusable carrier (10) includes a base (14) and a lid (16) attached to the base (14) by hinges (18). A flexible substrate (19) is attached to the base (14). Alignment posts (20) have tapered surfaces (22) that engage corners (24) of the integrated circuit (12) to position the integrated circuit (12) precisely on upper surface (26) of the substrate (19). A spring-loaded latch (28) engages projection (30) in aperture (32) of the base (14) to hold the lid (16) closed over the integrated circuit (12). Electrically conductive traces (34) on the surface (26) have contact bumps which engage contact pads on the underside of the integrated circuit (12) to connect the integrated circuit (12) to peripheral contact pads (38) around edges (40) of the substrate (19). A spring (42) engages upper surface (43) of the integrated circuit (12) when the lid (16) is in its closed position over the integrated circuit (12), to provide a biasing force to urge the contact pads against the conductive traces (34). Thereby, it is possible to be used as a various integrated circuit die within the die carrier.