发明名称 FLUID PROCESSING METHOD AND DEVICE OF TREATED MATERIAL
摘要 PURPOSE: A fluid processing method of the treated material is provided to fluid-process with highly purity at a low cost by circulating and using the fluid, which is used in the manufacturing process of a thin film device. CONSTITUTION: The fluid processing method is composed of the steps of: covering the surface of the processed material and the back face with a covering plate(11) and a back face covering plate(15) for preventing the surface and the back face of the processed material and revolving the processed material; fluid-processing the surface of the processed material by supplying the fluid between the surface of the processed material and the covering plate of the surface; recollecting the fluid which finishes the fluid process of the surface of the processed material; performing the fluid-process of the back face of the processed material by supplying the fluid which finishes the process of the surface of the recollected processed material between the back face of the processed material and the covering plate of the back face.
申请公布号 KR20000011650(A) 申请公布日期 2000.02.25
申请号 KR19990028055 申请日期 1999.07.12
申请人 KOKUSA ELECTRIC CO., LTD. 发明人 OKA, HITOSHI;MORITA, HUMIO;HUJIKI, MASATAKA;YAMAOKI, AKINOBU
分类号 B05D3/12;B08B3/00;B08B3/04;C23G1/00;(IPC1-7):B05D3/12 主分类号 B05D3/12
代理机构 代理人
主权项
地址