Lead frame with strip-shaped die bonding pad

摘要

A lead frame, comprises a pair of spaced apart rail portions and a plurality of leads therebetween for attachment to a semiconductor die and defining an area for accommodating a semiconductor device. A single, narrow, strip shaped tie bar of substantially constant width extends between and substantially perpendicular to the rail portions and traverses a narrow portion of the die receiving area. A die pad portion is provided for bonding to the die intermediate the ends of the strip.