| 发明名称 |
Method and apparatus for dissipating heat from an enclosed printed wiring board |
| 摘要 |
A housing encloses a multi-layer printed wiring board. A set of mounting heat sinks is fitted through the housing and contacts the multi-layer printed wiring board. The set of mounting heat sinks dissipates heat from the printed wiring board and is used to mount the printed wiring board to a wall.
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| 申请公布号 |
US6028355(A) |
申请公布日期 |
2000.02.22 |
| 申请号 |
US19980097971 |
申请日期 |
1998.06.16 |
| 申请人 |
AT&T CORP. |
发明人 |
GATES, FRANK VERNON |
| 分类号 |
H01L23/367;H05K3/46;H05K7/10;H05K7/20;(IPC1-7):H01L23/36 |
主分类号 |
H01L23/367 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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