| 摘要 |
PROBLEM TO BE SOLVED: To obtain an electroconductive resin paste having excellent electroconductivity and heat dissipation, substitutable with solder by including silver powders having specific physical properties, respectively, urethane di(meth) acrylate and mono(meth)acrylate. SOLUTION: This paste comprises (A) flake silver powder having >=4.5 g/cm3 tap density and 3-20μm average particle diameter, (B) fine spherical silver powder having 0.8-2.2μm average particle diameter, (C) a urethane di(meth) acrylate obtained by reacting a hydroxyalkyl monoacrylate with a polyalkylene glycol and an isocyanate, (D) a monoacrylate of formula I (R1 is a >=10C aliphatic and/or aromatic group) or a monomethacrylate of formula II (R2 is a >=10C aliphatic and/or aromatic group), (E) an organic peroxide as essential components in the ratios of 10-80 wt.% of the component A and 4-20 wt.% of the component B, 80-92 wt.% of the total silver components and in the weight ratio of the component C/D of 0.6-2.1.
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