发明名称 THERMAL HEAD AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To prevent a substrate from bending until a film formation process, a photolithography process and facilitate the bending at the time of assembling a head by cutting thick reinforcing parts of two parallel sides of a filmed substrate having an insulating glass coat applied to one face thereof and fixing the substrate to trace a curve part of a heat sink. SOLUTION: A first, a second glaze glasses 24a, 24b are formed to a left, a right front faces of an iron alloy substrate 21, a swell is formed in the vicinity of a common electrode part 22 to remove a thick reinforcing part of the substrate 21, and the substrate is fixed to trace a curve of a heat sink. One end parts of a first, a second discrete electrodes 26a, 26b formed at front faces of the glasses 24a, 24b are connected to one end parts of heat-generating resistance bodies 25a, 25b, and the other end parts are connected to a first, a second IC controllers. A common electrode 27 is arranged along the common electrode part 22, with having a rear face electrically jointed to a front face of the heat- generating resistance body 25. A thermal head 20 has a plurality of a first, a second heatgenerating resistance bodies 25a..., 25b.... A protecting layer 28 covers the whole front face of the first individual electrode 26a, etc.
申请公布号 JP2000052585(A) 申请公布日期 2000.02.22
申请号 JP19980226291 申请日期 1998.08.10
申请人 SHINKO ELECTRIC CO LTD 发明人 HANAKI ATSUSHI;KUBOTA TAKASHI
分类号 B41J2/335;(IPC1-7):B41J2/335 主分类号 B41J2/335
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