发明名称 Semiconductor device and method of manufacturing the same
摘要 A semiconductor device in which at least one lower electrode is formed on an insulating film formed on a semiconductor substrate, and a capacitive insulating film and an upper electrode are formed on a surface of said lower electrode, thereby forming a capacitive element, wherein said lower electrode has side walls each formed integrally on a side surface thereof and consisting of a conductive film whose lower end portion extends from a bottom surface of said lower electrode to a semiconductor substrate side.
申请公布号 US6028334(A) 申请公布日期 2000.02.22
申请号 US19960758258 申请日期 1996.11.27
申请人 NEC CORPORATION 发明人 SUMITANI, HIDETOSHI
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/108;(IPC1-7):H01L27/108 主分类号 H01L27/04
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