发明名称 SURFACE TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a surface treating device capable of uniformly subjecting a substrate of a large area to plasma treatment at a high speed, and moreover, reducing ion damage and capable of finishing it to a product of high quality. SOLUTION: Casing (2) is partitioned into two chambers of a plasma generating chamber (3) provided with a plasma generating electrodes (5 and 5') and a substrate treating chamber (4) provided with a substrate supporting stand (7). Plural plasma blow-off ports (6) are formed on the electrode (5') composing the bulkhead between the chambers (3 and 4). Moreover, on the substrate treating chamber (4), the substrate supporting stand (7) is arranged in such a manner that a substrate (S) is supported parallel to the flows of plasma from the plasma blow-off ports (6). The substrate supporting stand (7) is movable in the horizontal direction orthogonal to the blow-off direction of the plasma in a state in which the parallel interval with the blow-off direction of the plasma is held.
申请公布号 JP2000054145(A) 申请公布日期 2000.02.22
申请号 JP19980220612 申请日期 1998.08.04
申请人 KOMATSU LTD 发明人 MIZUKAMI HIROYUKI
分类号 C23C16/44;C23C16/455;C23C16/50;H01L21/205;H01L21/31;(IPC1-7):C23C16/50 主分类号 C23C16/44
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