| 摘要 |
A thermal head comprises a substrate having a main surface bounded by a peripheral edge, an electrode formed on the surface of the substrate, and a heater disposed on the surface of the substrate and electrically connected to the electrode. A driver IC is disposed on the surface of the substrate and is electrically connected to the electrode for providing a drive signal to drive the heater. An encapsulation element is disposed over the IC for protecting the IC. The encapsulation element has a surface portion which extends to the peripheral edge of the substrate.
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