发明名称 JET STREAM SOLDERING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a jet stream soldering device, which is suitable for unleading of a soldering while a desired soldering quality is obtainable in an inert atmosphere. SOLUTION: A soldering work space 13 is covered by a covering element 14, and the work W1 enter, exit openings 15, 21, 22 are formed on the covering element. An inert gas of high temperature, which can restrain a temperature decrease of a melted solder 11, is jetted from a high temperature gas jetting nozzle 18 against a jet flow tip end side of a melted solder so as to make a working space as of a high temperature inert atmosphere. At the openings of the cover element, a gas curtain 17 is formed by providing a curtain forming nozzle 16 for confining the high temperature inert gas in the work space by preventing an air entanglement to be caused by passing of the work.
申请公布号 JP2000052029(A) 申请公布日期 2000.02.22
申请号 JP19980230283 申请日期 1998.07.31
申请人 TAISEI KAKEN:KK 发明人 MATSUBARA YOSHIMASA
分类号 B23K31/02;B23K1/08;H05K3/34;(IPC1-7):B23K1/08 主分类号 B23K31/02
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