| 摘要 |
A decoupling capacitor incorporated into an integrated circuit. The capacitor is disposed over a first region of a substrate comprising electronic circuitry, and not over a second region of the substrate. The capacitor comprises a lower and an upper conductive layer separated by an interposing insulative layer. An additional insulative layer is disposed beneath the lower conductive layer while another insulative layer is disposed above the upper conductive layer, and the capacitor provides capacitance for the electronic circuitry.
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