| 摘要 |
The present invention generally provides a system for controlling the temperature of multiple components of a semiconductor processing device or fabrication facility. The system includes a common source of a heated or chilled fluid that is distributed to multiple process components for use in heating or cooling. The multiple process components may be part of the same chamber or process, serve different processes in the same or different cluster tool, serve a combination of stand-alone and cluster tools, or any combination of process components located in a common fabrication facility. Each process component includes a flow control valve that controls the temperature of each component.
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