WAFER POLISHING DEVICE

摘要

PROBLEM TO BE SOLVED: To easily work out a countermeasure on the occurrence of a polishing failure by easily locating a head used for polishing a manufactured wafer in question. SOLUTION: In the wafer polishing device, a head rotary mechanism is provided with wafer-holding heads 29 at positions facing the surface of a platen and run in parallel with a polishing pad, and arranged at spaced intervals around the revolving shaft of a carousel 34. The head rotary mechanism is provided with a rotary position detecting means 49 for detecting the positions of the wafer-holding heads 29 relative to the revolving shaft of the carousel 34.