发明名称 |
Methods of designing and fabricating intergrated circuits which take into account capacitive loading by the intergrated circuit potting material |
摘要 |
High speed integrated circuits are designed and fabricated by taking into account the capacitive loading on the integrated circuit by the integrated circuit potting material. Line drivers may be sized to drive conductive lines as capacitively loaded by the potting material. Repeaters may be provided along long lines, to drive the lines as capacitively loaded by the potting material. Intelligent drivers may sense the load due to the potting material and drive the lines as capacitively loaded by the potting material. The thickness of the passivating layer on the outer conductive lines may also be increased so as to prevent the potting material from extending between the conductive lines. High speed potted integrated circuits may thereby be provided.
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申请公布号 |
US6028986(A) |
申请公布日期 |
2000.02.22 |
申请号 |
US19980052249 |
申请日期 |
1998.03.31 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SONG, MINKYU |
分类号 |
H01L21/768;G02F1/136;H01L23/522;H01L29/786;(IPC1-7):G06F17/50 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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