| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition useful as a semiconductor sealing agent having excellent crack resistance and electrical characteristics by using a specific phosphine oxide compound as an essential component and including a specific epoxy resin and an ester-containing compound. SOLUTION: The objective composition is produced by including (A) an epoxy resin derived from a bisphenol of formula I (R7 is H or methyl) and (B) a curing agent comprising a bifunctional or polyfunctional ester-containing compound or ester-containing resin wherein 10-100 mol.% of hydroxyl group is esterified with an aliphatic acyl group. The composition further contains (C) a cure accelerator comprising a phosphine oxide compound of formula II (R1 to R6 are each H, a 1-10C alkyl or the like) as an essential component. The component B is preferably a novolak resin of formula III (R8 is H, methyl or the like; A is H or an aliphatic acyl; (n) is 0-100) or a phenolic aralkyl resin of formula IV (R9 is H, a 1-9C alkyl or the like; (m) is 1-3; (n') is 0-100), etc.
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