| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for reducing the adhesion of by-products. SOLUTION: A chamber (12) having an inner wall (17) in the periphery is prepd. and is charged with a semiconductor wafer, thereby, a ring (46) is set to inside the chamber closely to the inner wall in the periphery, and moreover, plural reactant gases (22) are introduced into the chamber and reacted, and furthermore, the heated gases are introduced into the chamber through the ring close to the inner wall in the periphery to raise the temp. of the inner wall in the periphery.
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