发明名称 INJECTION HOLDING DIE AND INJECTION MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an injection molding die and an injection molding method thereof in which the dimension modification of ejector pins generated following the dimension modification of a cavity is not required to improve the productivity thereof. SOLUTION: In the constitution of an injection molding die, a fixed side mold 1 and a movable side mold 2 are provided, and a cavity 3 is provided between the fixed side mold 1 and the movable side mold 2, and ejector plates 24 and 25, an ejector pin 26 and a return pin 27 are provided in the movable side mold 1, and in the mold opening process of the movable side mold 2, the ejector plates 22 and 25 and the ejector pin 26 are moved forward from the movable side mold 2 to release a molded product from the inside of a cavity 3, and also in the mold clamping process, the return pin 27 is brought into contact with the fixed side mold 1 to move backward the ejector plates 24 and 25 and the ejector pins 26 from the movable side mold 2, and a thickness adjustment material 13 is set on a site whereon the end of the return pin 27 of the fixed side mold 1 is brought into contact with.
申请公布号 JP2000052379(A) 申请公布日期 2000.02.22
申请号 JP19980220626 申请日期 1998.08.04
申请人 SEKISUI CHEM CO LTD 发明人 ASANO RYOJI
分类号 B29C45/26;B29C45/40;(IPC1-7):B29C45/26 主分类号 B29C45/26
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