发明名称 |
Method for minimizing warp and die stress in the production of an electronic assembly |
摘要 |
A method of minimizing warp and die stress in the production of an electronic assembly includes connecting one surface of a die to a package, and connecting an opposite surface of the die to a lid disposed over a constraining ring that is mounted to the package. The lid has a size, shape and coefficient of thermal expansion (CTE) selected to generate a bending moment that opposes bending moments resulting from connecting the die to the package.
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申请公布号 |
US6027590(A) |
申请公布日期 |
2000.02.22 |
申请号 |
US19980097773 |
申请日期 |
1998.06.16 |
申请人 |
W. L. GORE & ASSOCIATES, INC. |
发明人 |
SYLVESTER, MARK F.;PETEFISH, WILLIAM GEORGE;FISCHER, PAUL J. |
分类号 |
H01L23/28;H01L23/12;H01L23/14;H01L23/29;H01L23/31;H01L23/373;(IPC1-7):H05K13/00 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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