| 摘要 |
PROBLEM TO BE SOLVED: To provide a new preliminaly soldering device which is superior in an operational property, durability as a device for applying a preliminaly soldering during a soldering processing wherein a tip element is mounted on a circuit board by soldering in a manner that a soldering face of the tip element is placed downwardly. SOLUTION: This preliminaly soldering device 11 comprises; a solder basin 11a for storing a melted solder 16, a metal solder discharging head 11b mounted at an upper portion of the solder basin, a plunger pump 17 being dippingly arranged in the basin connecting with a solder supplying route 11d which leads to the solder discharge head, and a solder supply valve mechanism 18. The melted solder taken into the supplying route from the basin via the supply valve mechanism by a cooperated operation of the plunger pump and the supply valve mechanism is sent to the discharge head in a given volume at a time by the pump so as to discharge a ball shape solder 16a on a surface thereof. The preliminaly soldering is carried out by attaching the ball to a chip element 2 which is moving downwardly over the discharge head with the soldering surface facing downwardly.
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