发明名称 |
Probe head assembly |
摘要 |
An apparatus for testing semiconductor devices including probe tips for contacting input/output pads on the device attached to a probe membrane fixed to a package using a layer of elastomeric material. The elastomeric material and use of compliant bump probe tips effect a global planarization for improved electrical contact between the probe assembly and the input/output contacts on the device under test.
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申请公布号 |
US6028437(A) |
申请公布日期 |
2000.02.22 |
申请号 |
US19970858107 |
申请日期 |
1997.05.19 |
申请人 |
SI DIAMOND TECHNOLOGY, INC. |
发明人 |
POTTER, CURTIS NATHAN |
分类号 |
G01R1/073;(IPC1-7):G01R1/073 |
主分类号 |
G01R1/073 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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