发明名称 |
Pad definition to achieve highly reflective plate without affecting bondability |
摘要 |
A process for fabricating pixels and bonding pads wherein each has an optimal metal thickness in the fabrication of a LCD integrated circuit device is achieved. Semiconductor device structures are formed in and on a semiconductor substrate wherein the semiconductor device structures are covered by an insulating layer. A first metal layer is deposited overlying the insulating layer and patterned to form a metal line and a bonding pad. A dielectric layer is deposited overlying the metal line and the bonding pad. Vias are opened through the dielectric layer to the metal line but not to the bonding pad. A second metal layer is deposited overlying the dielectric layer and filling the via openings and etched back to form metal plugs. A third metal layer is deposited overlying the dielectric layer and metal plugs and patterned to form pixels contacting metal plugs. A passivation layer is deposited overlying the pixels. A via opening is etched through the passivation layer and the dielectric layer to the bonding pad. A wire bond is formed within the via opening to contact the bonding pad to complete the fabrication of the integrated circuit device.
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申请公布号 |
US6027999(A) |
申请公布日期 |
2000.02.22 |
申请号 |
US19980151159 |
申请日期 |
1998.09.10 |
申请人 |
CHARTERED SEMICONDUCTOR MANUFACTURING, LTD. |
发明人 |
WONG, GEORGE |
分类号 |
G02F1/1345;G02F1/1362;H01L21/60;(IPC1-7):H01L21/476 |
主分类号 |
G02F1/1345 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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