发明名称
摘要 PROBLEM TO BE SOLVED: To provide a portion packing paper melt adhering device which is economical as a consumption power is less and has a highly safe characteristic. SOLUTION: An ultrasonic wave melting and adhering mechanism 11 of a portion packing paper melt adhering device 6 for melting and adhering a portion packing paper 3 is comprised of a horn 15 which can be moved along a surface of the portion packing paper 3 and a receiving jig 16 for holding the portion packing paper 3 between it and the horn 15. Each of a melting and adhering part forming member 40 of the receiving jig 16 and a perforation forming part 41 is provided with adjustment screws 53 for adjusting their positions in such a direction as one moving toward or away from the horn 15, respectively. In addition, the base end 53a of the adjustment screw 53 is protruded out of a cover 17.
申请公布号 JP3012232(B1) 申请公布日期 2000.02.21
申请号 JP19990032043 申请日期 1999.02.09
申请人 发明人
分类号 A61J3/00;B29C65/00;B29C65/08;B29C65/74;B65B1/30;B65B9/08;B65B51/10 主分类号 A61J3/00
代理机构 代理人
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