发明名称 |
INTEGRAL CIRCUIT ASSEMBLY |
摘要 |
FIELD: radio engineering, in particular, for embedding integral circuits into cards. SUBSTANCE: invention discloses device design which provides targeted control of heat flow which enters integral circuit assembly from outside due to either heat insulation layer introduced between flexible carrying ribbon of integral circuit assembly and integral circuit glued over it, or recesses in surface or layer of metal contacts. Heat flow from hollow upper die which is located in external region of metal contacts is interrupted in direction towards integral circuit which is mounted in center. EFFECT: prevention peelings between cover body and integral circuit which is embedded by means of hot gluing. 4 cl, 4 dwg
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申请公布号 |
RU2145732(C1) |
申请公布日期 |
2000.02.20 |
申请号 |
RU19980107842 |
申请日期 |
1996.09.12 |
申请人 |
SIMENS AKTSIENGEZELL'SHAFT |
发明人 |
DETLEF UDO;JOZEF KIRSHBAUER;KHANS-GEORG MENSH;PETER SHTAMPKA;KHANS-KHINNERK SHTEKKHAN |
分类号 |
B42D15/10;G06K19/077;H01L21/58;H01L23/24;H01L23/498;(IPC1-7):G06K19/077 |
主分类号 |
B42D15/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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