| 摘要 |
PROBLEM TO BE SOLVED: To shorten a time required for a process transfer between lots. SOLUTION: In an aligner which exposes and transfers a reticle pattern to a wafer in accordance with a job transferred to the aligner and a predetermined calibration process, if the job and the reticle used in the exposure treatment of the wafer in the current lot are the same as the job and the reticle used in the exposure treatment of the wafer in the previous lot, a function S103 bypassing the repeated transfer S107 of the job to the device and/or a calibration S109 is applied to the current lot.
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