| 摘要 |
PROBLEM TO BE SOLVED: To make a projection amount of a conductive needle-shaped body highly accurate and improve a position accuracy at the time of simultaneous measurement of many points of a wafer under a high-temperature ambience. SOLUTION: A plate 3 constituting a holder is formed in a state with a first silicon layer 4, a silicon oxide layer 5 and a second silicon layer 6 layered. A small diameter hole part 7 is formed to the first silicon layer 4 and silicon oxide layer 5, while a large diameter hole part 8 is formed to the second silicon layer 6. A head part 9a of a conductive needle-shaped body 9 is supported by the small diameter hold part 7, and at the same time, a flange part 9b of the conductive needle-shaped body 9 and a compression coil spring 10 are received in the large diameter hold part 8. A conductive contactor 1 is formed in this manner. Since a projection amount of the flange part is regulated as the flange part butts with the silicon oxide film, a projection amount of the conductive needle-shaped body can be set highly accurately. Particularly, since the needle-shaped body is formed of the same material as a silicon wafer, the needle-shaped bodies are not displaced when measuring many points of the wafer simultaneously under a high-temperature ambience at a test time.
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