MASK FOR SEALING AND PRINTING SEMICONDUCTOR ELEMENT AND ITS USAGE

摘要

PROBLEM TO BE SOLVED: To make a whole sealing area to fall within a designed range when printed and sealed by providing clearances which fall within a specific range between at least partial peripheries of annular projecting sections and the surface of a wiring board. SOLUTION: A mask 3 has openings 31 and annular projecting sections 32 formed in accordance with the openings 31 on its rear surface side. The projecting sections 32 are formed in square frame-like shapes. The outer parts of the projecting sections 32 are made thinner than the whole thickness of the mask 3 so that form space sections 33 may be formed on the rear surface side of the mask 3. Each projecting section 32 has clearances 322 at its facing corners and, when the mask 3 is put on a wiring board 1, the openings 31 on the insides of the projecting sections 32 and the space sections 33 on the outsides of the sections 32 communicate with each other through the clearances 322. The heights (h) of the clearances 322 fall with the range of 0.01-0.5 mm, preferably, 0.05-0.3 mm.