| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductor wire suitable for thinning a semiconductor device in which inter-wire short circuit can be minimized. SOLUTION: The conductor wire 5 for connecting a semiconductor chip electrically with an external conductor comprises a first end part 5a being bonded to the electrode pad 2 of a semiconductor chip 1, a second end part 5b being bonded to an external conductor, and a point A1 being bent from the first end part 5a reversely to the rising direction of the conductor wire between the first and second end parts 5a, 5b. Since the conductor wire 5 is bent reversely to the rising direction thereof, rising amount of the conductor wire from the major surface of the semiconductor chip is suppressed and the semiconductor chip is made thin. When the conductor wires 5 are arranged alternately to wires 6 of conventional structure, a sufficient clearance is ensured between the wires and the possibility of short circuit is reduced. |
