| 摘要 |
PROBLEM TO BE SOLVED: To obtain a small package having reduced mounting area and to provide a semiconductor device in which handling is improved in production. SOLUTION: First and second insulating substrates 21a, 21b are pasted to produce an insulating substrate 21 and an island 24a is formed on the surface of the first insulating substrate 21a while internal electrodes 24b, 24c are formed on the surface of the second insulating substrate 21b. The upper part is coated with a resin layer 23 and the side faces 23a-23d of the package are formed of cut faces. Outer circumferential end faces 30, 31 of the first and second insulating substrates 21a, 21b are exposed to the side faces 23a-23d to form a coplanar plane. The insulating substrate 21 has a small thickness t1 at a part for mounting a semiconductor chip 22 and has a large thickness (t1+t2) at other parts. |
