发明名称 DICING TAPE AND DICING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a dicing tape, wherein related to such dicing tape as an adhesive layer is formed on one surface of a tape base material, a display part for displaying the cut depth of a tape is formed on the side of an adhesive- layer formation surface of the tape base material. SOLUTION: For a dicing tape 17, wherein an adhesive layer 16 is formed on one surface of a tape base material 13, a display part 15 for displaying a cut depth of a tape is formed on the surface of adhesive-layer formation surface of the tape base material 13. Related to a dicing method, a thin substrate 4 is pasted to the dicing tape 17, where the adhesive layer 16 is formed on one surface of the tape base material 13, and the level of a rotary blade 12 is so adjusted that a part of the dicing tape 17 is cut with the rotary blade 12 for completely cutting the substrate 4. Here, a display part 15 for displaying the cut depth by the rotary plate 12 is provided on the adhesive-layer formation surface side of the dicing tape 17, and based on the indication on the display part 15, the level of the rotary blade 12 is corrected.</p>
申请公布号 JP2000049121(A) 申请公布日期 2000.02.18
申请号 JP19980212747 申请日期 1998.07.28
申请人 NEC KANSAI LTD 发明人 OZAWA SHINICHI
分类号 C09J7/02;H01L21/301;(IPC1-7):H01L21/301 主分类号 C09J7/02
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