发明名称 ELECTRONIC CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic circuit device which dispenses with formation of apertures for through holes for taking out the lower electrode, which is provided on the lower surface of a flexible printed board, to the side of the upper surface of the board and the formation of a copper-plated layer on the inner walls of these through holes. SOLUTION: First and second upper lead electrodes 12 and 14 are respectively formed on the upper surface of a flexible printed board 10 consisting of a polyimide material, which is used as a dielectric material, and a lower common electrode 16 opposing to these two upper lead electrodes is formed on the lower surface of the board 10. In such a way, first and second capacitors C1 and C2 are constituted of the electrodes 12 and 14 and the electrode 16 holding the board 10 between them and a capacitor of a structure, wherein these two capacitors C1 and C2 are bonded in series to each other, is formed as a whole.
申请公布号 JP2000049436(A) 申请公布日期 2000.02.18
申请号 JP19980217866 申请日期 1998.07.31
申请人 SONY CORP 发明人 IWASHITA TAKESHI
分类号 H05K1/16;H01G4/38;(IPC1-7):H05K1/16 主分类号 H05K1/16
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