| 摘要 |
PROBLEM TO BE SOLVED: To prevent increase in a chip size when arranging pads required for realizing fundamentally essential functions, and to prevent the increase in signal pins used only for evaluation of needle stand. SOLUTION: On a bonding pad region 106 or around the bonding pad region 106, a plurality of standing needle pads 101-105 are provided for conducting a circuit test or switching a circuit connection. Among a plurality of the needle stand pads, a plurality of first standing needle pads 101, 102, 104 and 105 are each connected to at least one of input/output terminals 111-114 of a plurality of circuit sections 115 and 116 that are connected to internal circuits, and the second standing needle pad 103 is connected as a circuit for selecting one of the plurality of circuit sections. The first and second standing needle pads 101-105 are connected and disconnected so as to select one of the plural circuit sections 115 and 116 without input of a selection signal.
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