| 摘要 |
PROBLEM TO BE SOLVED: To provide a buzzer element applied to various electronic devices that is made thin in profile and has excellent flexibility. SOLUTION: The buzzer element is configured by overlapping an upper wiring board 13 where an upper electrode layer 12 is formed on one side of an insulation film 11 and a lower wiring board 17 where a dielectric layer 16 is printed on a lower electrode layer 15 formed on one side of an insulation film 14 so that the upper electrode layer 12 of the upper wiring board 13 and the dielectric layer 16 of the lower wiring board 17 are in contact with each other. Thus, a thin profile is obtained and the buzzer element with excellent flexibility is obtained. |
