| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photosensitive resin compsn. excellent in sensitivity and photosetting property and capable of efficiently forming a resist excellent in resolution and resistance to electroless copper plating by photolithography by incorporating a specified polyhydroxy-ether resin compd. and a specified blocked isocyanate compd. SOLUTION: The photosensitive resin compsn. contains 100 pts.wt., in total, of 20-90 pts.wt. polyhydroxy-ether resin compd. obtd. by allowing a polybasic acid anhydride to react with hydroxyl groups of a resin having repeating units of formula I in an equiv. ratio of 0.08-0.8 and 80-10 pts.wt. photopolymerizable unsatd. compd. having terminal ethylenically unsatd. groups, 0.1-20 pts.wt. photopolymn. initiator and 1-30 pts.wt. blocked isocyanate compd. of formula II. In the formula I, R1 is a 1-12C divalent satd. aliphatic hydrocarbon, R2 and R3 are each l-4C alkyl or the like and (x) and (y) are each an integer of 0-4. In the formula II, R4 is an m-valent org. group, (m) is an integer of 1-6 and R5 is the residue of a blocking agent. |
