| 摘要 |
PROBLEM TO BE SOLVED: To obtain a good scattering plane and to obtain a bright display body by forming fine irregularities on a reflection film in such a manner that the irregularities are finer than the roughness of the reflection film. SOLUTION: After the surface of a planer substrate 1 is cleaned with an org. substance, the substrate is exposed to plasma or UV+O3 to completely remove org. substances and contamination on the surface. Then a resist is applied by spin coating on the surface of the planer substrate 1, for example, to 1 to 10 μm thickness, and baked, for example, at 100 to 200 deg.C to form an org. thin film layer 2. Then a reflection thin film layer 4 consisting of an Al thin film or Pt thin film is formed by sputtering or vapor deposition on all over the org. thin film layer 2. In this process, the planer substrate 1 including the org. thin film layer 2 is heated to about 100 to 200 deg.C so that the fine irregularities necessary for diffusion reflection are formed at one time. Then the reflection thin film layer 4 is patterned by etching to form a reflection electrode 3. |
