LEAD FRAME, MANUFACTURE OF SEMICONDUCTOR DEVICE EMPLOYING IT AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a technology for mounting a semiconductor chip well while enhancing reflow crack resistance. SOLUTION: In the lead frame of a resin sealed semiconductor device and manufacturing technology thereof, a die pad 2 for mounting a semiconductor chip 11, in which specified circuits are fabricated, is formed substantially in cross. An insulating adhesive tape 5 is applied to the semiconductor chip mounting face of the die pad 2 so that the semiconductor chip 11 is mounted on the die pad 2 through the adhesive tape 5. Since adhesion area between the semiconductor chip 11 and sealing resin can be increased while ensuring adhesion area between the semiconductor chip 11 and the die pad 2, reflow crack resistance of semiconductor device can be enhanced.