| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which output power can be stabilized through an extremely simple structure being manufactured easily. SOLUTION: A semiconductor chip 1 including an amplifier circuit is mounted on the lead frame 5 in a mold package and covered with mold resin 4. A signal is connected through a bonding wire 6 with a lead frame terminal in order to communicate with the outside. A package is provided with a power output terminal 2 and an output power monitor terminal 3 arranged in parallel therewith at a length equal to about a quarter of the wavelengthλof a desired frequency (including the terminal length of the lead frame 5 and the length of the bonding wire 6) and connected with the semiconductor chip 1 through the bonding wire 6. The output power monitor terminal 3 is connected with a terminal resistor on the outside of the package.
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