SOLID-STATE ELECTROLYTIC CAPACITOR

摘要

PROBLEM TO BE SOLVED: To enable a solid-state electrolytic capacitor to tolerate the thermal shock applied to the capacitor when the capacitor is mounted on the surface of a lead frame by providing a copper metal layer on the surface of the lead frame and approximating the coefficient of line expansion of the lead frame to that of a molding resin. SOLUTION: A solid-state electrolytic capacitor is formed by connecting a lead frame 12 which becomes the lead-out terminal of the capacitor to the valve-action metal section and conductive layer section 10 of a capacitor element 11 and sealing the element 11 and parts of the frame 12 with a molding resin. At the time of forming the capacitor, a copper metal layer is provided at least on the surface of the frame 12 which comes into contact with the molding resin, and the coefficient of liner expansion of the lead frame 12 is approximated to that of the molding resin. In addition, the surface of the lead frame 12 which comes into contact with the molding resin is roughened to an Ra value of >=0.9μm and a gold metal layer is formed on the external surface of the lead frame 12 exposed from the molding resin.