发明名称 HIGH-FREQUENCY PLASMA TREATMENT METHOD AND APPARATUS FOR DETECTING TERMINATION OF PROCESS
摘要 PROBLEM TO BE SOLVED: To provide a high-frequency plasma treatment method for detecting a termination of process easily and surely and an apparatus for detecting the termination of process, in the treatment method for carrying out the high-frequency plasma treatment for a substrate. SOLUTION: In a high-frequency plasma treatment method, high-frequency power is supplied to a plasma treatment apparatus 1, and an oscillation frequency is conformed according to a variation in impedance of the plasma treatment apparatus 1. At this time, the oscillation frequency on the power-supply side is detected and a termination of the process is judged on the basis of a rate of change of the oscillation frequency. An apparatus for detecting the termination of the process includes a detecting means for detecting the frequency of the high-frequency power supplied to the plasma treatment apparatus 1, and an operation processing means for analyzing detected frequency data and judging the termination of the process on the basis of the rate of change of the oscillation frequency.
申请公布号 JP2000049146(A) 申请公布日期 2000.02.18
申请号 JP19980216770 申请日期 1998.07.31
申请人 KEM KK 发明人 KANEKO KAZUFUMI
分类号 H05H1/00;H01L21/302;H01L21/3065;H05H1/46 主分类号 H05H1/00
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