| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable silicon nitride circuit board and to mass- produce it. SOLUTION: This joined body is formed by joining a silicon nitride substrate provided with a division groove for which the thickness of the silicon nitride substrate at a division groove bottom part is 0.2-0.5 mm and a metal plate. Also, this circuit board is manufactured by using the joined body. In this case, it is desirable that the silicon nitride substrate is composed of the sintered compact of a green molding to which the division groove is executed and also, it is desirable that the silicon nitride substrate is the one to which the division groove is mode by laser working to a silicon nitride sintered compact.
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